Abstract: The assembly process of surface-mount device (SMD) usually requires over hundreds of types of surface-mount components (SMC). A set of SMCs should be picked in the warehouse to be supplied ...
Abstract: Electroless nickel electroless palladium immersion gold (ENPIG) is widely used for the surface finish of integrated circuit (IC) package substrate. The Ni-P coating has magnetic effects and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback