These X- and Y-capacitors in surface-mount housings, built to suppress EMI, reduce cost, and simplify production.

Abstract: In this paper, heat transfer on different surface mounted components is investigated during vapour phase reflow soldering (VPS), where the heat transfer is based on condensation of the heat ...

Manufacturing of a modern component-laded printed circuit board (PCB) is an amazing fusion and coordination of diverse technologies. There’s the board as substrate itself, the stencils and masks that ...

Abstract: In this paper we focus on the effect of highly increased current density and resulting temperatures in the microstructure of lead-free solder joints of chip-scale components in order to ...