Soteras CCS binder, a new binder technology from Ashland, enables manufacturers to address one of the biggest technology obstacles: heat shrinkage of the battery’s separator. Heat shrinkage can ...
HSINCHU, Taiwan –MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
Axiomtek has released NANO840, a new compact, low-power Nano-ITX board based on the quad-core SoC Intel Atom processor E3845 or dual-core E3827 with one DDR3L 1066/1333 up to 8 GB memory. Axiomtek ...
HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...
AUO (Kunshan) Gen 6 LTPS LCD Fab successfully lights up its first 5.5-inch Full HD display(source/AUO) AU Optronics Corp. ("AUO") today held a lighting ceremony at ...
因為不明的因素，導致網路系統發生錯誤，我們將於最短的時間內更正這個錯誤，麻煩您耐心等待。 若您有緊急的業務需要接洽，研討會報名與雜誌訂閱請來信發行部，廣告事務請接洽產業服務 ...
In its Global Wafer Capacity 2020-2024 report, IC Insights breaks down the world’s installed monthly IC wafer capacity by geographic region (or country). Figure shows the installed IC capacity by ...
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